$795.00 ships: 5 to 7 days | item#: RLS/976NM-500MW
- Up to 500 mW of CW Output Power
- Fiber Bragg Grating Stabilized
- PM Fiber Pigtail
- Highest Reliability Rating: Telcordia GR-468-CORE Compliant
- Integrated Cooler, Isolator and Back Facet Monitor
- Unterminated Fiber (No Connector)
- Offered by 3SP Technologies, a Laser Lab Source Marketplace Seller
Sold & Supported in North America by: LaserDiodeControl.com, part of the Laser Lab Source Marketplace Group
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|Electrical (typical @ case temperature 25C)|
|FIBER PIGTAIL and Termination|
High Power 976nm, 500mW Fiber Bragg Grating Stabilized Laser Diode Overview
These latest generation 14-pin butterfly packaged laser diodes from 3SP Technologies are fiber Bragg grating stabilized and offer up to 500 mW of output power. They are offered with a PM fiber pigtail and are unterminated (no connector). These high reliability 976nm laser diodes are used as the first stage seed source for amplification / fiber laser applications. They have an integrated TEC with 10K NTC thermistor and a monitor PD. The wavelength is “locked” utilizing a fiber Bragg grating (FBG) located in a polarization maintaining fiber (PMF). Single mode HI1060 fiber (SMF) is available on request. These modules have been qualified to meet TelcordiaTM GR-468-Core requirements for hermetically sealed 976nm / 980nm pump laser modules.
Important Notes on Operating Laser Diodes:
Electrical Operation: Operating a laser diode above the maximum ratings shown on the data sheet even for very short periods of time can damage the laser diode or reduce its lifetime. They should be electrically biased with a "laser diode driver" class current supply with low electrical noise and protection against voltage and current surges. Laser diodes are very sensitive to electrostatic discharge (ESD). Proper ESD precautions must be taken.
Mounting and Temperature Control: In order to maintain the lifetime of a laser diode, proper heat management is essential. Due to the design of the laser diode, heat is typically dissipated only through the base plate of the diode‘s package. A proper heat conducting interconnection between the diodes base plate and the heat sink must be maintained. Some devices require the use of a thermo-electric temperature controller (TEC controller) to remove the heat from the laser and stabilize the temperature.
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