$525.00 sku / item#: RLS/MDIL-976NM-300MW ships: 4 weeks
- 976 nm pump laser diode with epoxy free design for long term reliability
- 300 mW operating power
- Fiber Bragg Grating (FBG) in PM single mode fiber
- Telcordia GR-468-CORE qualification
- For fiber lasers and EDFA's requiring low power consumption
- Offered by 3SP Technologies, a Laser Lab Source Marketplace Seller
Sold & Supported in North America by: LaserDiodeSource.com, part of the Laser Lab Source Marketplace Group
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|Key Specifications (typical @ 25°C)|
The 1999 PLU from 3SP Group is a new pump product family specifically designed for applications where a compact size and low power consumption are required. Modules feature a mini-DIL package incorporating a new laser chip internally developed for uncooled operation over a wide temperature range from –5°C to 75°C ; chip is fully qualified exceeding Telcordia recommendations. Available kink-free power exceeds 330mW. The wavelength is “locked” utilizing a Fiber Bragg Grating (FBG) located in a single mode polarization maintaining fiber (PMF) pigtail.
These modules provide excellent stability and very wide dynamic range due to their specific design.
- Compact size, low noise Erbium-Doped Fiber Amplifiers requiring low power consumption
- Multi pumping architectures
Epoxy free design inside the mini-DIL module for long term Reliability
300mW operating power
Operating temperature up to 75°C
Fiber Bragg Grating (FBG)on PM
single mode fiber
FBG Stabilized, 980nm Uncooled
Pump Laser Module
Important Notes on Operating Laser Diodes:
Electrical Operation: Operating a laser diode above the maximum ratings shown on the data sheet even for very short periods of time can damage the laser diode or reduce its lifetime. They should be electrically biased with a "laser diode driver" class current supply with low electrical noise and protection against voltage and current surges. Laser diodes are very sensitive to electrostatic discharge (ESD). Proper ESD precautions must be taken.
Mounting and Temperature Control: In order to maintain the lifetime of a laser diode, proper heat management is essential. Due to the design of the laser diode, heat is typically dissipated only through the base plate of the diode‘s package. A proper heat conducting interconnection between the diodes base plate and the heat sink must be maintained. Some devices require the use of a thermo-electric temperature controller (TEC controller) to remove the heat from the laser and stabilize the temperature.
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